Intelligent Edge AI for Constrained & Contested Environments
Full-stack AI platform delivering sensor fusion, secure communications, and real-time inference on today's hardware, with purpose-built silicon on the horizon.
What We Deliver
Three Pillars of Mission Advantage
Integrated capabilities that work together at the edge, where connectivity is limited and milliseconds matter.
Edge AI Inference
Deploy trained models at the edge for real-time object detection, classification, and autonomous decision-making. No cloud required.
Sensor Fusion
Fuse vision, RF, LIDAR, and positioning data into a unified operational picture with deterministic, real-time processing.
Secure Communications
Post-quantum encrypted mesh networking with cognitive electronic warfare capabilities for contested RF environments.
Mission-Critical Applications
Purpose-built for defense and autonomous systems where performance, security, and reliability are non-negotiable.
ISR
Intelligence, Surveillance, Reconnaissance
Real-time processing of multi-sensor data for tactical awareness and threat detection.
Key Capabilities
- Multi-spectral sensor fusion
- Real-time object detection
- Pattern-of-life analysis
- Automated target recognition
Delivering Today, Building for Tomorrow
The LVS Edge SDK runs on existing hardware now. The LVS-250 will be a force multiplier when it ships, not a prerequisite for getting started.
LVS Edge SDK
Available Now
- AI model training, optimization & edge deployment
- Multi-modal sensor fusion (vision, RF, LIDAR)
- Retargetable runtime across COTS hardware
- Post-quantum encrypted mesh networking
- Vision AI and cognitive EW software agents
- Deterministic real-time processing pipelines
Runs on NVIDIA, Qualcomm, and other COTS hardware today. Seamless migration to LVS-250 silicon when available.
LVS-250 Silicon
Purpose-Built Hardware
- ~230 TOPS in a <25W, 35mm package
- Purpose-built chiplet architecture (5 UCIe chiplets)
- Integrated MRAM for instant-on in harsh environments
- Hardware root of trust with tRoot HSM
- ~30 TOPS/W, 6x more efficient than alternatives
- ITAR-compliant, U.S.-manufactured on GF 12LP+
Dev kits shipping to partners. Volume production targeted for 2027.
Expert Perspectives
Hear from industry leaders about the challenges driving next-generation edge AI development.
Electronic Warfare Capabilities
Dr. James Stewart
Chief Scientist, SSTM Disruptive EMSO S&T, NSWC Crane
Urgency for Next-Gen Chips
Dr. James Stewart
Chief Scientist, SSTM Disruptive EMSO S&T, NSWC Crane
Chinese Technology Threat
Maynard Holliday
Defense Industry Veteran
Built for the Edge
The LVS-250 combines breakthrough AI performance with military-grade security in a compact, power-efficient package.
Why Chiplets Over Monolithic?
Chiplet architecture isn't just a trend. It's the future of high-performance silicon, and here's why we chose this path.
Faster Time-to-Market
Reuse proven chiplet IP instead of designing monolithic from scratch.
Better Yields
Smaller dies have higher manufacturing yields than large monolithic chips.
Mix Process Nodes
Optimize each chiplet: advanced node for logic, mature node for analog/RF.
Modular Upgrades
Update individual chiplets without redesigning the entire system.
Single large die, all-or-nothing design, longer dev cycles
5 optimized dies, best-in-class per function, faster iteration
Ready to Transform Your Edge AI Capabilities?
Schedule a demo to see the LVS-250 in action. Our team will show you how next-generation edge AI can accelerate your mission.
Questions? Email us at info@lolavisionsystems.com